AN AQUEOUS SLURRY COMPOSITION FOR CHEMICAL MECHANICAL POLISHING AND CHEMICAL MECHANICAL POLISHING METHOD
摘要
<p>The present invention relates to an aqueous slurry composition for chemical mechanical polishing that can show good polishing rate to the target layer, and yet has a high polishing selectivity and can maintain superior surface condition of the target layer after polishing, and a chemical mechanical polishing method. The aqueous slurry composition for chemical mechanical polishing (CMP) includes abrasives; an oxidant; a complexing agent; and a polymeric additive including at least one selected from the group consisting of a polypropyleneoxide, a propyleneoxide-ethyleneoxide copolymer, and a compound represented by Chemical Formula 1.</p>
申请公布号
WO2009107986(A1)
申请公布日期
2009.09.03
申请号
WO2009KR00917
申请日期
2009.02.26
申请人
LG CHEM, LTD.;SHIN, DONG-MOK;CHOI, EUN-MI;CHO, SEUNG-BEOM;HA, HYUN-CHUL