发明名称 Miniature optical element for wireless bonding in an electronic instrument
摘要 A method of manufacturing an optical element including the steps of: forming a through hole in a semiconductor element which has an optical section and an electrode electrically connected to the optical section; and forming a conductive layer extending from a first surface of the semiconductor element on which the optical section is formed, through an inner wall surface of the through hole, to a second surface opposite to the first surface.
申请公布号 US2009221108(A1) 申请公布日期 2009.09.03
申请号 US20090453301 申请日期 2009.05.06
申请人 SEIKO EPSON CORPORATION 发明人 WADA KENJI
分类号 H01L21/30;H01L27/14;G02F1/13;H01L21/00;H01L21/28;H01L21/3205;H01L21/60;H01L21/768;H01L23/12;H01L23/48;H01L23/52;H01L27/146;H01L29/40;H01L31/00;H01L31/02;H01L31/0203;H01L31/18;H01L33/38;H04N5/335;H04N5/369 主分类号 H01L21/30
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