WAFER LEVEL PACKAGED MEMS DEVICE

摘要

An apparatus and method for sensor architecture based on bulk machining of silicon wafers and fusion bond joining which provides a nearly all-silicon, hermetically sealed, microelectromechanical system (MEMS) device. An example device includes a device sensor mechanism (34) formed in an active semiconductor layer and separated from a handle layer (32) by a dielectric layer (36), and a silicon cover plate (40) having a handle layer (42) with a dielectric layer (44) being bonded to portions of the active layer. Pit are included in one of the handle layers (32, 42) and corresponding dielectric layers (36, 44) to access electrical leads on the active layer (44). Another example includes set backs from the active components formed by anisotropically etching the handle layer while the active layer has been protectively doped.