发明名称 CASE MOLDED CAPACITOR
摘要 PROBLEM TO BE SOLVED: To provide a case molded capacitor used for an automobile etc., the case molded capacitor being made compact, lightweight, and inexpensive and also exhibiting superior moisture-proof performance. SOLUTION: The case molded capacitor molded with a resin after a plurality of elements 1 each having an oval-shaped section are connected in parallel with bus bars 2 each provided with a terminal portion for external connection at one end and they are stored in a case 3 while pairs of electrodes provided to the elements 1 are held vertically, can be improved in moisture-proof performance, since a portion affected by water entering from an opening surface of the molding resin 4 is reducible with a configuration of≤30% in flatness rate (a-b)/a, where the major-axis diameter of the oval section of the element 1 is denoted by a and the minor-axis diameter is denoted by b, when the thickness of the molding resin from an upper end of the element 1 resin-molded in the case 3 to an outer surface of the molding resin 4 is 12 mm or less. COPYRIGHT: (C)2009,JPO&INPIT
申请公布号 JP2009200134(A) 申请公布日期 2009.09.03
申请号 JP20080038255 申请日期 2008.02.20
申请人 PANASONIC CORP 发明人 NAGATA YOSHIYA;MIURA TOSHIHISA;SAITO TOSHIHARU
分类号 H01G4/224;H01G4/18 主分类号 H01G4/224
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