HEAT-DISSIPATING HOLE MECHANISM CAPABLE OF ADJUSTING AIRFLOW RATE AND PORTABLE COMPUTER DEVICE THEREOF

摘要

A heat-dissipating hole mechanism includes a vent structure and an adjusting pad. An opening is formed on the vent structure. The vent structure is used for guiding airflow from a fan to pass through the opening. The adjusting pad is removably disposed on the opening of the vent structure. A railing structure is formed on the adjusting pad. The railing structure is used for covering the opening so as to adjust a flow rate of the airflow.