| 摘要 |
PROBLEM TO BE SOLVED: To provide an adhesive composition with excellent low-temperature curability and storage stability, and a circuit connecting material using the same, and to provide a connector excellent in connection reliability, a connection method of a circuit member, and a semiconductor device. SOLUTION: The adhesive composition includes (A) an alicyclic epoxy compound and (B1) a cation generator which is a sulfonium phosphate having structure in which an alkenyl group, an allyl group, or a derivative thereof is bonded to a sulfur atom. The adhesive composition includes (A) an alicyclic epoxy compound and (B2) a cation generator which is a sulfonium phosphate having structure in which an aromatic group is not bonded to a sulfur atom. COPYRIGHT: (C)2011,JPO&INPIT |
