<p>PURPOSE: A laminate chip semiconductor package is provided to easily prevent the bridge phenomenon or short of an input and output unit which connects a chip to a substrate by forming a guide unit. CONSTITUTION: A top chip(10) is laminated on a bottom chip(12). An input and output unit electrically connects a bonding pad formed on the upper side of the bottom chip and the bonding pad formed on the lower side of the top chip. The input and output unit is comprised of a copper filler(16) and a solder(18) formed on the bonding pad of the top chip. The solder connects the copper filler of the top chip to the bonding pad of the bottom chip. A guide unit(14) is formed on the top of the bottom chip and supports the top chip.</p>
