| 发明名称 |
INTEGRATED CIRCUIT PACKAGE SYSTEM FOR ELECTROMAGNETIC ISOLATION AND METHOD FOR MANUFACTURING THEREOF |
| 摘要 |
A method for manufacturing an integrated circuit package system includes: providing a lead frame; forming an integrated circuit package including the lead frame; providing a selectively exposed area on the lead frame; and coating a conductive shielding layer on the integrated circuit package for coupling the selectively exposed area.
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| 申请公布号 |
US2011133316(A1) |
申请公布日期 |
2011.06.09 |
| 申请号 |
US201113028501 |
申请日期 |
2011.02.16 |
| 申请人 |
HUANG RUI;DO BYUNG TAI;CHOW SENG GUAN;KUAN HEAP HOE |
发明人 |
HUANG RUI;DO BYUNG TAI;CHOW SENG GUAN;KUAN HEAP HOE |
| 分类号 |
H01L23/552;H01L21/60 |
主分类号 |
H01L23/552 |
| 代理机构 |
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