SEALED ELECTRONIC HOUSING AND METHOD FOR THE SEALED ASSEMBLY OF SUCH A HOUSING

摘要

The invention relates to a method for the sealed assembly of an electronic housing (2, 20, 200) containing one or more electronic components (4), including the following steps: a step (B) of assembling the housing (2, 20, 200) by contacting a substrate (3), to which the electronic component(s) (4) is (are) secured, and a cover (5) using a mixture (18) including a paste (19) and nanoparticles (17) suspended in said paste (19), the size of the nanoparticles ranging from 10 to 30 nm; a step (C) of closing the housing (2, 20, 200) in a sealed manner by means of heating said housing (2, 20, 200) to a temperature T for sintering the metal nanoparticles (17) between 150°C and 180°C while subjecting the housing to a pressure higher than 2.5 105 Pa.