| 摘要 |
PURPOSE: A carrier for manufacturing a printed circuit board and a manufacturing method thereof are provided to reduce a manufacturing cost by using a flexible carrier substrate including a conductive layer. CONSTITUTION: The first circuit pattern is formed in a carrier consisting of a flexible insulating substrate(110) where a conductive layer(120) is formed. The first circuit pattern is buried to an insulating layer of an internal-layer circuit board. The carrier is removed. A via hole in which the metal material is filled in the insulating layer is formed. A bonding layer(T) is formed between the conductive layer and the flexible insulating substrate.
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