发明名称 Thermosetting epoxy resin composition
摘要 The thermosetting epoxy resin composition of the present invention includes an aluminum chelate/silanol curing catalyst system, an epoxy resin, and an anion-trapping agent. The anion-trapping agent is preferably an aromatic phenol derivative or an acid anhydride. Examples include bisphenol S, bisphenol A, bisphenol F, and 4,4′-dihydroxyphenol ether, and acetic anhydride, propionic anhydride, maleic anhydride and phthalic anhydride. The aluminum chelate/silanol curing catalyst system is composed of an aluminum chelator and a silane-coupling agent. The aluminum chelator is preferably a latent aluminum chelate curing agent carried by a porous resin obtained through interfacial polymerization of a polyfunctional isocyanate compound. Even when a terminal epoxy resin is contained as the epoxy component of a thermosetting epoxy resin composition containing an aluminum chelate/silanol curing catalyst system, the epoxy resin composition can be configured to cure rapidly at low temperatures without termination of polymerization.
申请公布号 US7851520(B2) 申请公布日期 2010.12.14
申请号 US20060884148 申请日期 2006.07.10
申请人 SONY CORPORATION;SONY CHEMICAL & INFORMATION DEVICE CORPORATION 发明人 KAMIYA KAZUNOBU
分类号 C08L63/00 主分类号 C08L63/00
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