HEATSINK, AND METHOD OF FABRICATING THE SAME

摘要

PROBLEM TO BE SOLVED: To provide a power-module heatsink small in thermal resistance for improvement of reliability, reduction in cost, reduction in size and increase of manufacturability.

SOLUTION: A heatsink assembly (10) for cooling a heated device (50) includes a ceramic substrate (64) having a plurality of cooling fluid channels (26) integrated therein. The ceramic substrate (64) includes a topside surface (56) and a bottom-side surface (68). A layer (62) of conductive material is bonded or brazed to only one of the topside and bottom-side surfaces (66), (68) of the ceramic substrate (64). The conductive material (62) and the ceramic substrate (64) have substantially identical coefficients of thermal expansion.

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