| 摘要 |
PROBLEM TO BE SOLVED: To reduce particles on a back surface of a substrate by removing air bubbles on the back surface of the substrate in development preprocessing. SOLUTION: A development processor includes a rotary base 2 for holding the substrate G, a rinse nozzle 8 configured to supply a cleaning solution to the substrate held by a substrate holding table 4 and a liquid reservoir space 7 to spread the liquid, a nozzle head 5 configured to supply a developer to the substrate, and a plurality of elevatable support pins 28a, 28b and 28c configured to transfer the substrate to and from a substrate carrying arm. One of the support pins has a first support surface for supporting the back surface of the substrate in a horizontal state and a second support surface for supporting a lower end of the substrate in an inclined state, and is configured to adjust the angle of the substrate, held on the rotary base, on a horizontal plane. The support pin is positioned where the substrate can be supported on the first support surface of the support pin in the horizontal state when the substrate is transferred, and the substrate is lowered in the inclined state in which the lower end of the substrate is supported on the second support surface when or after the cleaning solution is supplied to the substrate and into the liquid reservoir space, thereby removing air bubbles sticking on the back surface of the substrate. COPYRIGHT: (C)2011,JPO&INPIT
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