发明名称 POLYAMIDE RESIN COMPOSITION
摘要 <p><P>PROBLEM TO BE SOLVED: To provide a resin composition for a film, a sheet, and a thin-walled hollow container, which comprises a polyamide resin composition and is excellent in gas barrier properties while neither accelerating a crystallization rate nor spoiling transparency, and a molded product etc. obtained by molding the resin composition. <P>SOLUTION: The resin composition comprises adding 0.005-2 pts.wt of one or more bis(benzylidene)sorbitol (A) selected from bis(benzylidene)sorbitol and bis(alkylbenzylidene)sorbitol based on 100 pts.wt of a polyamide (X) which is formed from a diamine component including 70 mol% or more of xylylenediamine or bis(aminomethyl)cyclohexane and a dicarboxylic acid component including 70 mol% or more of a 4-20C aliphatic dicarboxylic acid. <P>COPYRIGHT: (C)2011,JPO&INPIT</p>
申请公布号 JP2010280754(A) 申请公布日期 2010.12.16
申请号 JP20090133064 申请日期 2009.06.02
申请人 MITSUBISHI GAS CHEMICAL CO INC 发明人 ODA HISAFUMI;MARUYAMA KATSUYA;OTAKI RYOJI
分类号 C08L77/06;C08K5/1575 主分类号 C08L77/06
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