发明名称 RECYCLING METHOD FOR COPPER OR COPPER ALLOY SCRAP SUBJECTED TO SILVER PLATING
摘要 PROBLEM TO BE SOLVED: To provide a recycling method with which silver is safely and efficiently peeled from copper or copper alloy scrap subjected to silver plating, and the copper or the copper alloy scrap from which the silver plating has been peeled is used as the raw material for producing copper or a copper alloy. SOLUTION: The copper or copper alloy scrap C whose surface has been subjected to silver plating is dipped into an electrolytic tank 2 charged with an electrolytic peeling solution E composed of at least one kind selected from aliphatic organic acid and the salt thereof and a nonionic surfactant so as to electrolytically peel the silver plating, and the copper or copper alloy scrap from which the silver plating has been peeled is used as the raw material for producing the copper or the copper alloy. COPYRIGHT: (C)2011,JPO&INPIT
申请公布号 JP2011021232(A) 申请公布日期 2011.02.03
申请号 JP20090166797 申请日期 2009.07.15
申请人 MITSUBISHI SHINDOH CO LTD 发明人 SAKURAI TAKESHI;ISHIKAWA SEIICHI;KUBOTA KENJI
分类号 C25F5/00 主分类号 C25F5/00
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