发明名称 CERAMIC CORE AND MANUFACTURING METHOD THEREOF AND CHIP-SHAPED ELECTRONIC COMPONENTS USING THE SAME
摘要 <P>PROBLEM TO BE SOLVED: To provide an ultrasmall chip-shaped electronic component and a ceramic core used therein, which secures the necessary bonding strength of electrode terminals when mounted on a circuit board. <P>SOLUTION: A ceramic core comprises a core part and a leg for holding the core part by both edges thereof, measuring 1.1 mm or less in the lengthwise direction and 0.6 mm or less in the breadthwise direction in a plan view. The edge of a protruding part of the leg in the breadthwise direction of the ceramic core has its corners and ridgelines curved at a radius of curvature of 5-25 &mu;m. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2011223025(A) 申请公布日期 2011.11.04
申请号 JP20110148252 申请日期 2011.07.04
申请人 KYOCERA CORP 发明人 UEDAHIRA TOSHIO;MATSUMOTO YOSHIHIRO
分类号 H01F17/04;H01F27/255;H01F41/02 主分类号 H01F17/04
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