| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a high-frequency device and a printed board holding structure, on which stable soldering in simple processing steps can be performed when a printed board and a case are soldered by reflow soldering, and excellent electric features can be obtained. <P>SOLUTION: The high-frequency device and the printed board holding structure include a projection formed to project to the inside of a case, a solder guiding hole formed on the projection to guide solder for joining the printed board and the case from the inner peripheral side to the outer peripheral side of the case, a board recess formed on the printed board at a position corresponding to the projection, and a land face formed on the printed board along an edge of the board recess. The printed board is interpolated in the case to be positioned such that a part of the solder guiding hole comes above the land face. <P>COPYRIGHT: (C)2012,JPO&INPIT |
