发明名称 |
CONDUCTIVE PARTICLES AND METHOD FOR PREPARING THE SAME |
摘要 |
<p>PURPOSE: A conductive particle and a manufacturing method thereof are provided to form a conductive coating film through low temperature heat treatment by forming a seed particle on the surface of a base particle. CONSTITUTION: A base particle(1) comprises metal. The base particle comprises Cu or Ni. The base particle is formed into a sphere shape in which average diameter is 0.01 to 1,000micrometers. A second metal layer is formed on the base particle. A seed particle(3) is formed on the surface of second metal layer. A first metal layer(5) is formed on the second metal layer. The first metal layer comprises Au or Ag. The first metal layer surrounds the seed particle and comprises a bump which is projected. The height of the bump is 5 to 100nm.</p> |
申请公布号 |
KR101151366(B1) |
申请公布日期 |
2012.06.08 |
申请号 |
KR20110123675 |
申请日期 |
2011.11.24 |
申请人 |
HANWHA CHEMICAL CORPORATION |
发明人 |
SON, WON IL;SIM, YOU JIN;OH, SEOK HEON |
分类号 |
H01J9/02;H01B1/02;H01J17/04;H01L31/042 |
主分类号 |
H01J9/02 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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