发明名称 POLYAMIDE RESIN COMPOSITION AND MOLDING
摘要 <P>PROBLEM TO BE SOLVED: To provide a polyamide resin composition excellent in rigidity after water absorption (water absorption rigidity), rigidity under high temperature use (rigidity at heating), appearance, and flame retardancy. <P>SOLUTION: The polyamide resin composition includes: (A) a polyamide copolymer; and (B) a phosphinate and/or a diphosphinate. The polyamide copolymer includes: a dicarboxylic acid component unit including (a-p) adipic acid unit, (b-p) isophthalic acid unit, and (c-p) 1,4-cyclohexanedicarboxylic acid unit; and a diamine component unit, wherein the relation of the content (mol%) of the (b-p) and the content (mol%) of the (c-p) based on 100% by mol of the dicarboxylic acid component unit including the (a-p), the (b-p), and the (c-p) satisfies the following formula (1): (the content of the (c-p))>(the content of the (b-p))&ge;0.1. <P>COPYRIGHT: (C)2012,JPO&INPIT
申请公布号 JP2012184277(A) 申请公布日期 2012.09.27
申请号 JP20110046136 申请日期 2011.03.03
申请人 ASAHI KASEI CHEMICALS CORP 发明人 SASAKI YUKIYOSHI;KURIHARA TETSUO
分类号 C08L77/06;C08G69/26;C08K3/00;C08K5/5313 主分类号 C08L77/06
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