| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a semiconductor light emitting module changing the arrangement of semiconductor light emitting elements, and also to provide an image reader using the same. <P>SOLUTION: A semiconductor light emitting module A1 is provided with a supporting conductor 1 including a die bonding pad 11 and a plurality of semiconductor light emitting elements 2R, 2G, 2B bonded to the die bonding pad 11. The semiconductor light emitting elements 2R, 2G, 2B are arranged in series along an arrangement line L1. The die bonding pad 11 includes a portion overlapping alternative die bonding positions 2R', 2B', which are axisymmetrical to die bonding positions of the semiconductor light emitting elements 2R, 2G, 2B with respect to a line of symmetry S. <P>COPYRIGHT: (C)2009,JPO&INPIT |
