发明名称 METHOD FOR REMOVING DEBRIS, METHOD FOR CUTTING GLASS BODY, METHOD FOR MANUFACTURING PACKAGE, PACKAGE, PIEZOELECTRIC VIBRATOR, OSCILLATOR, ELECTRONIC DEVICE AND RADIO-CONTROLLED TIMEPIECE
摘要 <P>PROBLEM TO BE SOLVED: To effectively remove debris while preventing a glass body from being marred. <P>SOLUTION: A method for removing debris relatively moves the glass body 60 and a porous body 84 to each other in a surface direction along one surface 50b while bringing the porous body 84 which holds a fluid containing a fine granular material with the particle size of 1 &mu;m or less, into press contact with the one surface 50b. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2012206196(A) 申请公布日期 2012.10.25
申请号 JP20110072732 申请日期 2011.03.29
申请人 SEIKO INSTRUMENTS INC 发明人 KAWADA YASUO
分类号 B24B27/033;B23K26/00;B24B37/00;H01L23/08;H03B5/32;H03H3/02;H03H9/02 主分类号 B24B27/033
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