发明名称 LIGHT-EMITTING MODULE
摘要 <P>PROBLEM TO BE SOLVED: To provide a light-emitting module to which a substrate provided with a light-emitting element chip can be simply attached, does not shield the emission light of the light-emitting element chip, has high light-emitting quality and a small-sized body, and saves a cost. <P>SOLUTION: A light-emitting module 10 includes: a plurality of LED chips 11e mounted on a rectangular insulation substrate 11a; a sealing body 11d for sealing the LED chips 11e; external electrodes 11f and 11g disposed and formed at opposite corner parts on the insulation substrate 11a, and connected to the LED chips 11e; a holding substrate 14 for holding the insulation substrate 11a; a holding contact terminal 12 intersecting two sides sharing a corner of the insulation substrate 11a, and connected and fixed to the holding substrate 14 at both end portions; and a projecting portion 12a projecting downward from the holding contact terminal 12, and contacted and electrically connected to the external electrodes 11f and 11g. The highest part from the insulation substrate 11a in the holding contact terminal 12 is formed to be lower than the highest part from the insulation substrate 11a in the sealing body 11d. <P>COPYRIGHT: (C)2013,JPO&INPIT
申请公布号 JP2013008847(A) 申请公布日期 2013.01.10
申请号 JP20110140684 申请日期 2011.06.24
申请人 TOYODA GOSEI CO LTD 发明人
分类号 H01L33/62 主分类号 H01L33/62
代理机构 代理人
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