SUBSTRATE PROCESSING APPARATUS AND SUBSTRATE PROCESSING METHOD

摘要

PURPOSE: An apparatus and a method for processing a substrate are provided to reduce processing costs and to improve substrate processing quality by rapidly forming a liquid layer to cover a main surface of the substrate. CONSTITUTION: A spin chuck(2) supports and rotates a substrate. A rotation driving device(3) rotates the spin chuck around a vertical axis line. A chemical supply unit(4) supplies the chemical to the substrate supported on the spin chuck. A rinse solution supply unit(8) supplies rinse solutions to the substrate supported on the spin chuck. A chemical buffer tank(5) temporarily stores the same chemical as the chemical supplied by the chemical supply unit. A pressurized gas supply unit(6) includes a gas pipe(31) connected to the chemical buffer bank and a pressurized gas valve(32) installed in the gas pipe. A control unit(7) discharges processing solutions from a processing solution nozzle to the main surface of the substrate. [Reference numerals] (19) Swing driving device; (22) Rinse solution supply source; (3) Rotation driving device; (33) Pressurized gas supply source; (7) Control unit;