| 摘要 |
<P>PROBLEM TO BE SOLVED: To provide a resin film capable of compatibly obtaining whole isolating layer characteristics (bulk characteristics) and surface characteristics such as adhesiveness, and to provide a build-up wiring board obtained by using the same. <P>SOLUTION: The resin film, converted to a B-stage which is used as an interlayer insulation material of a build-up wiring board, comprises: a first resin layer which is thermosetting; and a thermosetting second resin layer, laminated on one side surface of the first resin layer, excellent in adhesive strength to copper whose surface is not roughened, and whose thickness is 10% of a whole thickness or thinner. <P>COPYRIGHT: (C)2013,JPO&INPIT |
