摘要 |
By a wire end joining method, conductors are integrally joined to each other by applying ultrasonic vibration in a predetermined direction to a conductor bundle obtained by bundling the conductors exposed from a plurality of wires. In a conductor bundle forming process, the conductor bundle is formed by bundling the conductors while interposing metallic foils or plates between the conductors adjacent in a predetermined direction which is an applying direction of the ultrasonic vibration. In an ultrasonic joining process, the conductors are integrally joined to each other by applying the ultrasonic vibration to the formed conductor bundle while pressing the formed conductor bundle in the predetermined direction.
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