发明名称 SAW WIRE
摘要 PROBLEM TO BE SOLVED: To provide a saw wire which has satisfactory wear resistance, allows quality of a cut out wafer to be kept satisfactory and furthermore has little risk of wire breaking in use.SOLUTION: In a saw wire 1, brass plating 3 is applied to a surface of a saw wire body 2. The saw wire body 2 has a wire diameter of 0.04 to 0.14 mm and has a Martens hardness of 6,500 N/mmor more in a position at a depth of 8% of a radius from the surface. If a Martens hardness in a position at a depth of 8% of a radius from the surface is 6,500 N/mmor more, a wear amount of the saw wire body 2 is not increased as compared with a conventional one. Further, if a diameter of the saw wire body 2 is in a range of 0.04 to 0.14 mm, wire breaking of the saw wire body 2 is not generated upon cutting of an ingot and a thickness of a wafer cut out from the ingot using the saw wire body 2 becomes uniform.
申请公布号 JP2013129026(A) 申请公布日期 2013.07.04
申请号 JP20110280696 申请日期 2011.12.22
申请人 TOKYO SEIKO CO LTD 发明人 SHIOYA TOMOKI
分类号 B24B27/06;H01L21/304 主分类号 B24B27/06
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