| 摘要 |
PROBLEM TO BE SOLVED: To improve manufacturing efficiency of a power conversion device that includes a semiconductor unit in which semiconductor modules and coolers are laminated.SOLUTION: A power conversion device includes: a semiconductor unit 20; a frame 12 on which the semiconductor unit 20 is to be mounted; and a spring unit 6. The frame 12 has a wall 14 on a first side, in a lamination direction, of a position in which the semiconductor unit 20 is to be mounted. On a second side of the same, the frame 12 has support insertion holes 15 in which supports 13 are to be mounted. The spring unit 6 has a first plate 4, a second plate 5, and a spring 3 sandwiched therebetween. The spring unit 6 is inserted between the supports 13 and an end surface 20a of the semiconductor unit 20 in the lamination direction, and supports the semiconductor unit 20 while applying pressure to the semiconductor unit 20. Since the supports 13 are detachable, the semiconductor unit 20 and the spring unit 6 can be assembled together before the supports 13 are fixed. |
