| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a semiconductor package in which a heat radiating member can be arranged in the vicinity of a semiconductor device without performing processing of a substrate after resin molding the semiconductor device, and provide a manufacturing method of the semiconductor package. <P>SOLUTION: An upper substrate 20 is connected, via a spacer member 18, to the upper surface of a lower substrate 12 on which a semiconductor device 14 is mounted. A portion including a bottom surface 24b of a heat radiating member 24 protrudes from the back surface of the upper substrate 20. A space between the upper substrate 20 and the lower substrate 12 is filled with a mold resin 22, and the semiconductor device 14 is resin-molded. The bottom surface 24b of the heat radiating member 24 adheres to the mold resin 22. <P>COPYRIGHT: (C)2012,JPO&INPIT</p> |
