| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a heat conductive substrate which preserves density of a heat-conductive resin layer substantially uniform, irrespective of portions of the heat-conductive resin layer.SOLUTION: A heat conductive substrate comprises: a metal plate 7; a heat-conductive resin layer 8 which is mounted on an upper surface side of the metal plate 7, and includes a heat hardening resin and filler; and a conductor pattern 9 which is embedded in an upper surface side of the heat-conductive resin layer 8 so as to expose an upper surface side thereof. The conductor pattern 9 is formed of a plurality of wiring sections 10 which are formed by punching a plate-like conductor. Density of the heat hardening resins respectively located between the plurality of wiring sections 10 and density of the heat hardening resins located between the plurality of wiring sections 10 and the metal plate 7 are equalized. Density of the filler respectively located between the plurality of wiring sections 10 and density of the filler located between the plurality of wiring sections 10 and the metal plate 7 are also equalized.</p> |
