LED PACKAGE AND ITS MANUFACTURING METHOD

摘要

The present invention relates to an LED package and a method for producing the same for easily performing the underfill of the package having an LED in a flip chip type. The present invention includes: a substrate which the LED in the flip chip type is installed in; a hydrophilic coating layer which is installed in the substrate and is formed around the LED; and an encapsulating material which is installed in the substrate to cover the LED to be induced to the LED direction by the hydrophilic coating layer.