发明名称 |
LIGHT SOURCE HAVING LIQUID ENCAPSULANT |
摘要 |
In one embodiment, a light source comprising a substrate, a die, a liquid encapsulant, an attachment member and a resilient cover configured to hold the liquid encapsulant is disclosed. At least a portion of the resilient cover is easily stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion. One other embodiment discloses a light-emitting device comprising a die, a liquid encapsulant and the resilient cover. The resilient cover may comprise a dome shaped portion, a vertical portion and a thermal joint portion. In another embodiment, a lighting apparatus having similar resilient cover is disclosed. The resilient cover may further comprise a thermal joint portion having first and second indentations for absorbing thermal expansion. |
申请公布号 |
US2015028370(A1) |
申请公布日期 |
2015.01.29 |
申请号 |
US201313952060 |
申请日期 |
2013.07.26 |
申请人 |
Avago Technologies General IP (Singapore) Pte. Ltd. |
发明人 |
Yong Lig Yi;Ng Keat Chuan;Ko Choon Guan |
分类号 |
H01L33/54;H01L33/58 |
主分类号 |
H01L33/54 |
代理机构 |
|
代理人 |
|
主权项 |
1. A light source, comprising:
a substrate; a die disposed on the substrate; a liquid encapsulant surrounding the die; a resilient cover configured to hold the liquid encapsulant; and an attachment member to secure a portion of the resilient cover onto the substrate, wherein at least a portion of the resilient cover is stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion. |
地址 |
Singapore SG |