发明名称 LIGHT SOURCE HAVING LIQUID ENCAPSULANT
摘要 In one embodiment, a light source comprising a substrate, a die, a liquid encapsulant, an attachment member and a resilient cover configured to hold the liquid encapsulant is disclosed. At least a portion of the resilient cover is easily stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion. One other embodiment discloses a light-emitting device comprising a die, a liquid encapsulant and the resilient cover. The resilient cover may comprise a dome shaped portion, a vertical portion and a thermal joint portion. In another embodiment, a lighting apparatus having similar resilient cover is disclosed. The resilient cover may further comprise a thermal joint portion having first and second indentations for absorbing thermal expansion.
申请公布号 US2015028370(A1) 申请公布日期 2015.01.29
申请号 US201313952060 申请日期 2013.07.26
申请人 Avago Technologies General IP (Singapore) Pte. Ltd. 发明人 Yong Lig Yi;Ng Keat Chuan;Ko Choon Guan
分类号 H01L33/54;H01L33/58 主分类号 H01L33/54
代理机构 代理人
主权项 1. A light source, comprising: a substrate; a die disposed on the substrate; a liquid encapsulant surrounding the die; a resilient cover configured to hold the liquid encapsulant; and an attachment member to secure a portion of the resilient cover onto the substrate, wherein at least a portion of the resilient cover is stretchable so as to absorb size increment of the liquid encapsulant due to thermal expansion.
地址 Singapore SG