| 发明名称 |
SUBSTRATE STRUCTURE AND SEMICONDUCTOR PACKAGE HAVING THE SAME |
| 摘要 |
A substrate structure is provided. The substrate structure includes a substrate body; a metal layer formed on a surface of the substrate body; an insulating layer formed on the surface of the substrate body and having at least an opening for exposing the metal layer; and at least a die attach area defined on the surface of the substrate body corresponding in position to the opening for a semiconductor chip to be disposed thereon. The die attach area covers the entire opening or the metal layer is formed within the die attach area, thereby effectively preventing package delamination and improving the product yield. |
| 申请公布号 |
US2015028485(A1) |
申请公布日期 |
2015.01.29 |
| 申请号 |
US201313950638 |
申请日期 |
2013.07.25 |
| 申请人 |
Siliconware Precision Industries Co., Ltd. |
发明人 |
Hung Liang-Yi;Chih Shih-Chao;Pai Yu-Cheng;Hsiao Wei-Chung |
| 分类号 |
H01L23/48 |
主分类号 |
H01L23/48 |
| 代理机构 |
|
代理人 |
|
| 主权项 |
1. A substrate structure, comprising:
a substrate body; a metal layer formed on a surface of the substrate body; an insulating layer formed on the surface of the substrate body and having at least an opening exposing the metal layer; and at least a die attach area defined on the surface of the substrate body corresponding in position to the opening for a semiconductor chip to be disposed thereon, wherein the die attach area covers whole the opening or the metal layer is formed within the die attach area. |
| 地址 |
Taichung TW |
