SEMICONDUCTOR PACKAGE AND ITS MANUFACTURING METHOD

摘要

PURPOSE: A semiconductor package and a manufacturing method thereof are provided to remove a rewiring process for mounting a second semiconductor chip on a first semiconductor chip by mounting one or more first and second semiconductor chips on both sides of a substrate using a flip chip bonding. CONSTITUTION: A first printed circuit board(100) includes an upper side and a lower side which face each other. A first semiconductor chip(300) is mounted on the upper side of the first printed circuit board with a flip chip bonding. A second semiconductor chip(200) is mounted on the lower side of the first printed circuit board with the flip chip bonding. A first printed circuit board(400) is mounted on the lower side of the first printed circuit board to be electrically connected to the first printed circuit board. A molding member(500) covers the upper side and the lower side of the first substrate.