| 摘要 |
<P>PROBLEM TO BE SOLVED: To reduce the types of members and simplify the manufacturing processes for downsizing a package even in an LED device including an LED element having a sapphire substrate. <P>SOLUTION: An LED device 10 includes a sapphire substrate 14 and an LED element 16 having protruding electrodes 18, 19. A phosphor sheet 11 is placed on an upper surface of the sapphire substrate 14, and the phosphor sheet 11 and the sapphire substrate 14 are bonded to each other through an adhesive layer 13. A side part of the LED element 16 is covered by a white reflection member 17. The protruding electrodes 18, 19 of the LED element 16 serve as connection electrodes to a mother board. <P>COPYRIGHT: (C)2013,JPO&INPIT |
