| 摘要 |
<p>Provided is a heat radiation sheet (300) of a multilayer complex structure with high heat conduction and diffusion performance in vertical and horizontal directions. The heat radiation sheet (300) of the multilayer complex structure includes: a first layer (310) which is composed of a double-sided tape, a second layer (320) which is formed on the upper side of the first layer and is made of metal, a third layer (330) which is formed on the upper side of the second layer and is composed of the double-sided tape, a fourth layer (340) which is formed on the upper side of the third layer and is made of the metal, and a fifth layer (350) which is formed on the upper side of the fourth layer and is formed by mixing a heat radiation filler with a silicon material. A center part between the second layer and the fourth layer includes a preset space part (335) by partially removing the double-sided tape comprising the third layer. Multiple holes (345) vertically passing through the fourth layer (340) and the fifth layer (350) are formed to expose a part of the space part. Thereby, heat generated in an electronic component is easily discharged by efficiently inducing a heat conduction and a heat discharge in the vertical and horizontal directions of the heat radiation sheet.</p> |
