| 摘要 |
PROBLEM TO BE SOLVED: To provide a printed wiring board for simultaneously solving reduction in the diameter of a via hole that is difficult by conformal method in the printed wiring board, and reduction in the diameter of a land that is difficult by laser direct method, and to provide a manufacturing method therefor. ! SOLUTION: In a printed wiring board where the copper conductor of a multilayer substrate having the copper conductor at least on one side is used in a laser mask, and having a via hole with reduced diameter where a plurality of non-through via holes are formed in the multilayer substrate by performing conformal laser boring, the laser mask is provided with openings of diameter φ0 at the parts matching the arrangement positions of the plurality of non-through via holes provided in the multilayer substrate, and is the copper conductor where the diameter of the opening is reduced by plating. ! COPYRIGHT: (C)2015,JPO&INPIT |
