MILLIMETER WAVE BANDS SEMICONDUCTOR PACKAGE AND MILLIMETER WAVE BANDS SEMICONDUCTOR DEVICE

摘要

Certain embodiments provide a millimeter wave bands semiconductor package including a first metal block, a second metal block, and a circuit board. The first metal block includes a first penetration hole and a second penetration hole, each of which has a flattening film on an inner surface thereof. The second metal block includes a first non-penetration hole and a second non-penetration hole, each of which has a flattening film on an inner surface thereof. The circuit board is disposed between the first metal block and the second metal block and has an input signal line and an output signal line on a front side surface thereof. The first metal block and the second metal block are disposed such that the first non-penetration hole and the first penetration hole constitute a first waveguide and the second non-penetration hole and the second penetration hole constitute a second waveguide.

主权项

1. A millimeter wave bands semiconductor package comprising:
a first metal block including a first penetration hole and a second penetration hole, each of the first penetration hole and the second penetration hole having a flattening film on an inner surface thereof; a second metal block including a first non-penetration hole and a second non-penetration hole, each of the first non-penetration hole and the second non-penetration hole having a flattening film on an inner surface thereof; and a circuit board that is disposed between the first metal block and the second metal block and that has an input signal line and an output signal line in a front side surface thereof, wherein the first metal block and the second metal block are disposed such that the first non-penetration hole and the first penetration hole constitute a first waveguide and the second non-penetration hole and the second penetration hole constitute a second waveguide.