| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide an IC tag capable of reducing the possibility for an IC chip to be destroyed or an antenna from being disconnected with an inflection load as a factor, and a manufacturing method thereof. <P>SOLUTION: An IC tag comprises an inlet 10 including an inlet substrate 11, an antenna 13 disposed on the inlet substrate 11 and an IC chip 15 disposed on the inlet substrate 11 and connected to the antenna 13, a soft exterior member 20 which accommodates the inlet 10 internally, a first reinforcement plate 30 disposed on a front side 10a of the inlet 10, and a second reinforcement plate 40 disposed on a rear side 10b of the inlet 10. The first reinforcement plate 30 and the second reinforcement plate 40 are partially overlapped in a planar view, and the IC chip 15 is positioned in a partially overlapped area (overlapped reinforcement area) A1. Rigidity in the overlapped reinforcement area A1 is high and rigidity in an area (one-sided reinforcement area) A2 where only one of the first reinforcement plate 30 and the second reinforcement plate 40 is disposed in the planar view, is lower than that in the overlapped reinforcement area A1. <P>COPYRIGHT: (C)2013,JPO&INPIT</p> |
