发明名称 |
VACUUM PROCESSING APPARATUS |
摘要 |
<p>PROBLEM TO BE SOLVED: To provide a technique for enabling highly uniform processing in a substrate plane and enabling high throughput by increasing the number of substrates to be processed in a butch.SOLUTION: A vacuum processing apparatus comprises: a rotation table provided in a vacuum container and rotated along a horizontal surface; a driving mechanism for rotating the rotation table; substrate holding parts arranged in a plurality of lines along a circumferential direction on the rotation table and holding each substrate inclined with the surface of the substrate oriented in the direction in which the substrate is arranged; a heating part for heating each substrate held by the substrate holding part; a processing gas supply part for supplying processing gas to each substrate held by the substrate holding part; and a vacuum exhaust mechanism for vacuum exhausting the inside of the vacuum container. Such a configuration makes it possible to increase the number of substrate mounted on the rotation table, and enhance the uniformity of processing within a plane by forming a laminar flow in a substrate surface.</p> |
申请公布号 |
JP2015185750(A) |
申请公布日期 |
2015.10.22 |
申请号 |
JP20140062007 |
申请日期 |
2014.03.25 |
申请人 |
TOKYO ELECTRON LTD |
发明人 |
HASEBE KAZUHIDE;KAKIMOTO AKINOBU;SHIMIZU AKIRA |
分类号 |
H01L21/31;C23C16/455;C23C16/458;H01L21/324 |
主分类号 |
H01L21/31 |
代理机构 |
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代理人 |
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主权项 |
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地址 |
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