发明名称 VACUUM PROCESSING APPARATUS
摘要 <p>PROBLEM TO BE SOLVED: To provide a technique for enabling highly uniform processing in a substrate plane and enabling high throughput by increasing the number of substrates to be processed in a butch.SOLUTION: A vacuum processing apparatus comprises: a rotation table provided in a vacuum container and rotated along a horizontal surface; a driving mechanism for rotating the rotation table; substrate holding parts arranged in a plurality of lines along a circumferential direction on the rotation table and holding each substrate inclined with the surface of the substrate oriented in the direction in which the substrate is arranged; a heating part for heating each substrate held by the substrate holding part; a processing gas supply part for supplying processing gas to each substrate held by the substrate holding part; and a vacuum exhaust mechanism for vacuum exhausting the inside of the vacuum container. Such a configuration makes it possible to increase the number of substrate mounted on the rotation table, and enhance the uniformity of processing within a plane by forming a laminar flow in a substrate surface.</p>
申请公布号 JP2015185750(A) 申请公布日期 2015.10.22
申请号 JP20140062007 申请日期 2014.03.25
申请人 TOKYO ELECTRON LTD 发明人 HASEBE KAZUHIDE;KAKIMOTO AKINOBU;SHIMIZU AKIRA
分类号 H01L21/31;C23C16/455;C23C16/458;H01L21/324 主分类号 H01L21/31
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