| 摘要 |
<p><P>PROBLEM TO BE SOLVED: To provide a film like adhesive used in a back grind process, dicing process and flip chip-bonding process of a semiconductor wafer and excellent in the peeling property of a back grind tape and wafer protecting property. <P>SOLUTION: This film like adhesive is provided by laminating an adhesive layer, a thermosetting resin layer and a second plastic layer on a first plastic layer in this order, and having≤50 N/m peeling force at 90°peeling test between the adhesive layer and thermosetting resin layer at any of 300 mm/min and 500 mm/min peeling speeds. <P>COPYRIGHT: (C)2011,JPO&INPIT</p> |
