METHOD OF PROCESSING METALLIC PARTIAL DEPOSITES

摘要

The method comprises (i) forming a metal layer (5) on a transparent or semi-transparent substrate (1) by vacuum depositing process; (ii) forming a photoresist layer (6A) consisting of polyvinyl cinnamate resin and sensitizer on the metal layer (5); (iii) irradiating the photomasked part (6B) of photoresist layer with ultraviolet radiation; and (iv) removing the photoresist layer and metal layer of the non-irradiated part (6A) to clean the coated substrate (1) in alkali aqueous solution, after converting physical properties of the irradiated part (6B) of photoresist layer.