| 摘要 |
<p>PROBLEM TO BE SOLVED: To provide a method of forming leads high in quality and yield without producing solder tailings induced by rubbing, wherein the method is capable getting free from defects in a roller method or a movable die method and forming leads high in flatness even if a work is a warped semiconductor package. SOLUTION: A semiconductor package 1 with a semiconductor lead 2 previously bent obliquely downward from its root by preliminary bending is supported so as to make its root 2' located at a gap between a forming die 6 which has a molding part corresponding to the final shape of the lead 2 and an upper die pressing member 5. A bending punch 3 possessed of a molding part 4 at its tip corresponding to the final shape of the lead 2 is made to press the lead 2 in almost the same linear direction with the chord of an arc-shaped locus drawn by the bending part of the lead 2, whereby the lead 2 is bent into a shape like a gull wing.</p> |
