Electronic device

摘要

An electronic device 100 includes a casing 101 configured to accommodate electronic components. The casing 101 includes an outer layer member 131 formed by a metal and exposed to an outside, and an inner layer member 132 formed by a metal and spaced from an inner surface of the outer layer member 131. Conductive projections 140a and 140b are each formed between the inner layer member 132 and the outer layer member 131, and are each configured to extend like a line on a surface of one of the inner layer member 132 and the outer layer member 131 and have a top end that contacts with the other of the inner layer member 132 and the outer layer member 131, to electrically connect between the inner layer member 132 and the outer layer member 131.

主权项

1. An electronic device, comprising:
a casing configured to accommodate electronic components, wherein
the casing includes an outer layer member formed by a metal and exposed to an outside, and an inner layer member formed by a metal and spaced from an inner surface of the outer layer member,a conductive projection is formed between the inner layer member and the outer layer member, and is configured to extend in a line on a surface of one of the inner layer member and the outer layer member and have a top end that contacts with the other of the inner layer member and the outer layer member, to electrically connect between the inner layer member and the outer layer member,the casing further includes an adhesive layer formed between the outer layer member and the inner layer member that adheres the outer layer member and the inner layer member to each other, andthe adhesive layer is adhered to one of side surfaces of the conductive projection or formed close to one of the side surfaces of the conductive projection.