发明名称 COMPONENT MOUNTING APPARATUS
摘要 PROBLEM TO BE SOLVED: To achieve a bending operation for inserting the lead of a component into a hole bored in a board, and bending the lead so that the component is not pulled out easily from the board, with a simple structure.SOLUTION: Gripping claws 40 attached to a mounting head 6 hold an electronic component D, and insert the lead 41 thereof into a hole 47 provided in a printed circuit board P. A bending jig pin rises and an inclined plane 49, formed at the upper end thereof, abuts against the lead 41 of the electronic component D pressed by the gripping claws 40, and the lead 41 is bent as the bending jig pin 44 rises. In this way, the lead 41 is prevented from being pulled out.
申请公布号 JP2015226037(A) 申请公布日期 2015.12.14
申请号 JP20140111988 申请日期 2014.05.30
申请人 YAMAHA MOTOR CO LTD 发明人 KAMEDA MAKIO;WATANABE AKIO;SHUYAMA SHUJI
分类号 H05K13/04 主分类号 H05K13/04
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