MEMS DEVICE

摘要

PROBLEM TO BE SOLVED: To reduce the stress due to heat deformation of a circuit board or the like without decreasing the acceleration transferring to a displacement part, in a MEMS structure formed in a laminated body including a substrate layer, an insulating layer, and a surface layer.SOLUTION: The substrate layer includes: a support substrate having a fixed electrode; an outer frame that is disposed around the support substrate and is separated from the support substrate by a groove penetrating the substrate layer in the thickness direction; and a first flexible unit that is disposed between the support substrate and the outer frame and connects the support substrate to the outer frame. The surface layer includes: a displacement unit having a movable electrode; a fixed unit fixed to a surface of the support substrate via an insulating layer; and a second flexible unit for connecting the fixed unit to the displacement unit.