发明名称 BONDING METHOD
摘要 PROBLEM TO BE SOLVED: To provide a bonding method which can easily bond metal plates with each other by using a resin sheet.SOLUTION: Provided is a method for bonding a first component 10 and a second component 20, comprising respectively a metal plate with its surface coated with a resin, with a molding (resin sheet) 30 being interposed therebetween. The bonding method comprises: a first step of placing the molding 30 at a joint part 140 where the first component 10 and the second component 20 are bonded; and a second step of bonding the first component 10 and the second component 20 with the molded body 30 being interposed therebetween by heating the first component 10 and the second component 20 by a high frequency heating method to melt and thereafter solidify the molded body 30.
申请公布号 JP2015223815(A) 申请公布日期 2015.12.14
申请号 JP20140111674 申请日期 2014.05.29
申请人 S.B. SHEET WATERPROOF SYSTEM CO LTD 发明人 KIMURA SHINGO
分类号 B29C65/36 主分类号 B29C65/36
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