| 摘要 |
PROBLEM TO BE SOLVED: To provide a laser processing apparatus and laser processing method capable of suppressing occurrence of damage on the surface of a processed object opposite from the laser light incident side.SOLUTION: A laser processing apparatus 300 includes a laser light source 202 emitting laser light L, a light collection optical system 204 for collecting the laser light L on a processing object 1, and a reflective spatial light modulator 203 for modulating the laser light L so as to be branched into at least first processing light and second processing light, and the first processing light is collected at a first focal point and the second processing light is collected at a second focal point. When the radius of the first processing light is on the surface of the processing object 1 is W1, the radius of the second processing light on the surface 3 is W2, and the distance between the first focal point and second focal point is D when viewing from the surface 3, the reflective spatial light modulator 203 modulates the laser light L so as to satisfy a relation D>W1+W2. |
