| 主权项 |
1. An image pickup apparatus comprising:
a solid-state image pickup device chip; a flexible printed circuit board connected at one end to the solid-state image pickup device chip,
wherein, in an unfolded state, the flexible printed circuit board has a first surface facing a first direction along a layering axis, and a second surface facing a second direction opposite to the first direction along the layering axis,wherein in the flexible printed circuit board comprises:
a first portion defining a primary mounting region, wherein the first portion has a first end and a second end defining a longitudinal axis of the first portion, and wherein the longitudinal axis is perpendicular to the layering axis;a second portion defining one or more secondary mounting regions and one or more deformation regions, wherein each of the one or more deformation regions extend along a corresponding folding axis that is parallel to the longitudinal axis of the first portion; anda third portion defining a thirdly mounting region, wherein the third portion extends along the longitudinal axis from at least the second end of the first portion with other deformation region intervened,wherein, in a folded state, the second portion of the flexible printed circuit board is folded in the one or more deformation regions along the corresponding folding axis and at least a part of the third portion is folded with the other deformation region deformed such that the primary mounting region, the one or more secondary mounting regions, and at least the part of the thirdly mounting region are layered along the layering axis, andwherein, in the folded state, the thirdly mounting region is located in a region separate from the primary mounting region and the one or more secondary mounting regions with deformation of the other deformation region; a plurality of electronic components mounted on the first surface of the flexible printed circuit board in the primary mounting region and the one or more secondary mounting regions, wherein a lead wire connecting portion is mounted on the first surface or the second surface in the thirdly mounting region to be connected with lead wires of a signal cable which transmits an electrical signal of an image picked up on an image pickup surface of the solid-state image pickup chip to an external apparatus, wherein each of the plurality of electronic components mounted on different ones of the primary mounting region and the one or more secondary mounting region, and the lead wire connecting portion mounted in the thirdly mounting region are insulated to be out of direct contact with each other in the primary mounting region, the one or more secondary mounting regions, and the thirdly mounting region, by the flexible printed circuit board in the folded state, wherein the second surface of the flexile printed circuit board has no electronic component mounted thereon, and wherein in the folded state of the flexible printed circuit board, the lead wire connecting portion is located on an outermost layer. |
