MULTI-COMPONENT INTEGRATED HEAT SPREADER FOR MULTI-CHIP PACKAGES

摘要

A multi-component heat spreader comprising a top component having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof. The multi-component heat spreader further includes at least one additional component, such as a footing component or a spacer component, having a first surface and an opposing second surface with either a cavity extending therein from the second surface thereof or a projection extending from the second surface thereof, which is opposite from the top component cavity/projection. The additional component is attached to the top component, such as by brazing, wherein the top component cavity/projection is mated to the additional component cavity/projection.

主权项

1. A multi-component integrated heat spreader, comprising:
a top component having a first surface, an opposing second surface, and either a cavity or a projection formed at the top component second surface; at least one additional component having a first surface, an opposing second surface, and either a cavity or a projection, differing from the top component cavity or projection, formed at the additional component first surface; and wherein the at least one additional component is attached to the top component with the cavity or the projection of the top component is mated with the cavity or the projection of the at least one additional component.