<p>A planar device includes a heating circuit that is disposed between ceramic layers and co-fired with the ceramic. The heating circuit comprises palladium, and the co-firing of the palladium and ceramic is performed in an oxidizing atmosphere. The formation of defects in the planar device that would otherwise be induced as a result of the palladium oxidizing during the co-firing process is prevented by control of the firing profile, by the geometry of the pattern of the heating circuit, and/or by modifying the palladium to reduce its tendency to oxidize.</p>
